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TC4钛合金电子束沉积修复工艺研究 被引量:4

Electron Beam Deposition Repair Process of TC4 Titanium Alloy
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摘要 目的研究TC4钛合金电子束沉积修复工艺对修复试样成形形貌的影响。方法主要对电子束流、送丝速度和成形速度3种工艺参数进行研究,观察其宏观形貌,从而归纳出工艺参数对电子束沉积修复钛合金TC4的影响规律。结果在一定范围内,电子束流较小时,母材与修复区熔合不良,产生"V"型孔洞缺陷;随着电子束流增大,热影响区也随之增大。送丝速度主要影响试样的外观成形,较快或较慢的送丝速度都会使修复试样表面成形不良。成形速度较小时,成形表面有密集的鱼鳞纹,修复试样余高较低;成形速度增大时,热影响区随之减小,同时会产生孔洞缺陷。结论不同的电子束流、送丝速度、成形速度都会对TC4钛合金电子束沉积修复形貌产生重要影响,需要合理的控制工艺参数。 The paper aims to study the effect of TC4 titanium alloy electron beam deposition repair process on the morphology of repaired samples. The paper mainly studied three process parameters of electron beam current, wire feeding speed and forming speed to observe its macroscopic shape and summarize influences of process parameters on repair of titanium alloy TC4 by electron beam deposition. Within a certain range, when the electron beam current was small, the matrix and the repair zone were poorly fused, resulting in "V" type hole defects. As the electron beam current increased, the heat affected zone also increased. The wire feeding speed mainly affected the appearance of the sample. Fast or slow wire feeding speed caused the surface of the repaired sample to be poorly formed. When the forming speed was small, the forming surface had dense fish scales, and the residual height of the repairing sample was low; when the forming speed was increased, the heat-affected zone was reduced, and hole defects generated at the same time. Different electron beam currents, wire feeding speed and forming speed will have important influences on the electron beam deposition morphology of TC4 titanium alloy, which requires reasonable control of process parameters.
作者 刘容光 卜文德 刘小江 柯黎明 LIU Rong-guang;BU Wen-de;LIU Xiao-jiang;KE Li-ming(National Defence Key Discipline Laboratory of Light Alloy Processing Science and Technology, Nanchang Hangkong University, Nanchang 330063, China)
出处 《精密成形工程》 2018年第6期102-106,共5页 Journal of Netshape Forming Engineering
关键词 电子束沉积修复 电子束流 送丝速度 成形速度 electron beam deposition repair electron beam current wire feeding speed forming speed
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