热压缩对Cu-Sn合金晶界分布的影响

Effect of Hot Compression on Distribution of Grain Boundary in Cu-Sn Alloy

对Cu-Sn合金进行了高温等温压缩试验,热压缩应变速率为0.01s^-1、热变形温度为550~700℃。并利用EBSD技术分析了该合金在不同区域的高温变形及组织特征。结果表明:随变形温度逐渐升高,∑3晶界分布频率由6.1%升高至39.2%,但在650℃时出现强烈的动态回复,大面积的亚结构与变形区域出现,出现∑3^n(n=1,2,3)回落现象。

The high temperature isothermal compression test of Cu-Sn alloy was carried out.The hot compression strain rate was 0.01s^-1 and the hot deformation temperature was 550-700℃.The high temperature deformation and microstructure of the alloy in different regions were analyzed by EBSD technique.The results show that with the increase of deformation temperature,the distribution frequency of the ∑3 grain boundary rises from 6.1%to 39.2%,but there is strong dynamic recovery at 650℃,large area substructure and deformation area appear,and the decline phenomenon of ∑3^n(n=1,2,3)occurs.