基体脉冲偏压对TiN/Cu纳米复合薄膜组织结构、力学及耐磨性能的影响（英文）

Effect of Substrate Pulse Bias Voltage on the Microstructure and Mechanical and Wear-resistant Properties of TiN/Cu Nanocomposite Films

采用轴向磁场增强电弧离子镀在高速钢基体上沉积了Ti N/Cu纳米复合薄膜,研究了基体脉冲偏压幅值对薄膜成分、结构、力学性能及耐磨性能的影响。结果表明,薄膜中铜含量随着脉冲偏压幅值的增加先增加而后降低,在一个较低的范围内(1.3 at%～2.1 at%)。X射线衍射结果表明所有的薄膜均出现Ti N相,并未观察到Cu相。薄膜的择优取向随着脉冲偏压幅值的增加而改变。薄膜的最高硬度为36 GPa,是在脉冲偏压幅值为-200 V时得到的,对应了1.6 at%的Cu含量。与纯的Ti N薄膜相比,Cu的添加明显增强了薄膜的耐磨性能。

TiN/Cu nanocomposite films were deposited on high-speed steel (HSS) substrates by axial magnetic field-enhanced arc ion plating (AMFE-AIP).The effects of substrate bias voltage on chemical composition,microstructure,mechanical and tribological properties of the films were investigated by X-ray photoelectrons spectroscopy (XPS),X-ray diffraction (XRD),nanoindentation and wear measurements,respectively.The results show that the Cu content increases first and then decreases with the increase of the pulse bias voltage,being a low value in the range of 1.3 at %-2.1 at %.XRD results show that only the TiN phase appears in all the films,and no Cu phase is observed.The preferred orientation of the films changes significantly with the increasing pulse bias voltage.A maximum value of hardness of 36 GPa is obtained under a pulse bias voltage of -200 V,corresponding to the film containing 1.6 at % Cu.Compared to the pure TiN film,the Cu addition in TiN films significantly improves the wear resistance.