基于有限差分法的埋置结构OEPCB散热分析及优化

Thermal Analysis and Optimization of the Buried OEPCB Based on the Finite Difference Method

针对在传统印刷电路板(PCB)中埋置光波导结构而引发的集热问题,开展埋置结构光电印制板(OEPCB)的散热分析研究与优化。首先构造埋置结构OEPCB的导热模型,然后采用有限差分方法求解传热方程,最后利用FloTHERM软件进行仿真分析与优化。结果表明,在使用目前常用材料的情况下,光波导埋置结构OEPCB的温度场分布并不均匀,极易导致PCB板层的热应力差,进而对结构造成破坏。通过优化光波导芯层、外层导热材料的导热率,可有效降低OEPCB层间温度场梯度,保证光波导埋置结构植入后结构的热稳定性。仿真结果显示,经优化后,现有温度场最高温度处的温度下降22.40%,其他处亦有下降。

Aiming at the heat collecting problem caused by embedding the optical waveguide structure in the traditional printed circuit board( PCB),the thermal analysis and optimization of the opticalelectronic printed circuit board( OEPCB) with the buried structure were carried out. Firstly,the heat conduction model of the OEPCB with the buried structure was constructed. Then the finite difference method was used to solve the heat transfer equation. Finally,the FloTHERM software was used for the simulation analysis and optimization. The results show that the temperature field distribution of the OEPCB with optical waveguide embedded structure is not uniform using the commonly used materials,which can easily lead to the thermal stress difference of the PCB layers and then damage the structure. By optimizing the thermal conductivity of the thermal conductive materials of the core and the outer layer,the temperature field gradient between the OEPCB layers were reduced,and the thermal stability of the structure after implanting the optical waveguide embedded structure was ensured. The simulation results show that after the optimization,the highest temperature of the existing temperature field drops by22. 40%,and other position also decrease.