摘要
针对微电路封装中的锡膏印刷钢网开口,提出了一种新的处理方法。通过自编程序,直接对CIF格式的印刷钢网数据进行焊盘自动识别和焊盘形状的自动处理。利用公开软件,实现CIF数据与其他钢网数据之间的互相转换。该方法具有处理速度快、精度高、易于实现等特点,适用于处理各种EDA软件导出的锡膏印刷钢网开口数据。
A new processing method for stencil opening of solder paste printing in microcircuit packaging was proposed.By using the self-compiled data processing program,the pad's classification identification and shape transformation could beprocessed automatically in CIF data.With the help of opening software,mutual conversion of data formats between CIF and other data had been implemented.The method had the characteristics of fast processing speed,high precision and easy realization,etc.It could be used to process the printed stencil opening data of solder paste coming from various EDA software.
作者
张颖
李华伟
沈小刚
ZHANG Ying;LI Huawei;SHEN Xiaogang(Sichuan Institute of Solid-State Circuits,China Electronics Technology Group Corp.,Chongqing 400060,P.R.China)
出处
《微电子学》
CAS
CSCD
北大核心
2018年第6期846-849,共4页
Microelectronics
基金
模拟集成电路国家重点实验室基金资助项目(614280204030217)
关键词
印刷钢网开口
自动处理
CIF数据
opening of .printed stencil
automatic processing
CIF format data
