摘要
该文对某型号TO-252的胶厚合格率进行了分析。针对目前该型号产品的胶厚合格率偏低问题导入六西格玛质量管理模式对生产流程中的各项要素、参数和指标进行了研究,通过分析定义了关键问题,通过MSA对装片完成后显微镜聚焦测量法进行了改善,保证了测量系统的精确性和准确性。通过对流程中的变量因子的重要性验证并提出相应的改善方法,最终使该型号TO-252封装的胶厚合格率达成预期目标。
In this paper,the qualified rate of rubber thickness of a model TO-252 is analyzed.Aiming at the problem of low qualified rate of rubber thickness of this type of product at present,the Six Sigma quality management mode is introduced to study the factors,parameters and indicators in the production process.The key problems are defined and analyzed.The microscopic focusing measurement method after filling is improved by MSA,which ensures the accuracy of the measurement system.Sex and accuracy.By verifying the importance of variables in the process and putting forward corresponding improvement methods,the rubber thickness qualified rate of the TO-252 package can reach the expected goal.
作者
潘明东
杨阳
朱悦
Pan Ming-dong;Yang Yang;Zhu Yue(Jiansu Changjiang Electronics Technology,Jiangsu Suqian 223800)
出处
《电子质量》
2018年第12期60-62,共3页
Electronics Quality
关键词
六西格玛
胶厚
半导体封装
Six Sigma management
Epoxy thickness
Power Device Packaging