一种改进的双螺旋结构MEMS加热器的设计和制造（英文）

Design and Fabrication of a MEMS Heater with the Improved Double-Spiral Structure

设计制造了一种改进的双螺旋结构MEMS加热器,可用于高温气体传感器作为加热和传感单元。该MEMS加热器以Si为基底,SiO2/Si3N4纳米薄膜作为绝热层,Pt/Ti金属薄膜作为加热单元和传感单元。通过应用并联的线宽由内向外逐渐减小的双螺旋结构,实现温度的均匀性和低功耗。用Comsol进行仿真优化结构,通过MEMS工艺加工制造出器件并进行了测试,用红外显微测温仪测试器件在不同电压下的电热特性。该器件表现出低功耗、响应迅速、高可靠性和高的温度电阻系数(TCR)等特点。器件加热到687.7℃,功耗仅120 mW。器件的升温(23~600℃)响应时间和降温(600~23℃)响应时间分别为1 ms和2.5 ms。该加热器可以在687.7℃的高温下工作至少5 h而保持性能不变。

A micro-electromechanical system(MEMS)heater with the improved double-spiral structure was designed and fabricated for a heating unit and sensing unit in the high temperature gas sensor.The MEMS heater utilized silicon as the substrate,SiO2/Si3 N4 nano thin film as the heat insulating layer,and Pt/Ti layer as the heating unit and sensing unit.Low power consumption and temperature uniformity are realized by using the multipled double-spiral structure,and the width of the spiral structure is gradually narrowed down from inner to outer.The simulation optimization of the structure was performed by Comsol.The device was fabricated by standard MEMS manufacturing technology.Then the electro-thermo properties of the device at different voltages were tested by an infra-red microscopic thermometer.The device has the characteristics of low power consumption,quick response,high reliability,high temperature coefficient of resistance(TCR)and so on.The power consumption of the device is only 120 mW when the device is heated up to 687.7℃.The temperature increase(23-600℃)response time and temperature decrease(600-23℃)response time of the device are 1 ms and 2.5 ms,respectively.The heater can work at 687.7℃for at least 5 h to maintain the performances.