硅树脂改性丙烯酸酯压敏胶的热性能与微观结构

The thermal properties and microstructures of acrylate pressure-sensitive adhesive modified by silicone resin

采用溶液聚合法将含有乙烯基的硅树脂共聚到丙烯酸酯链节中,合成了硅树脂改性丙烯酸酯压敏胶,并研究了硅树脂的最佳加入时间和加入用量。研究结果表明:加入含有乙烯基的硅树脂体系高温区出现新的玻璃化转变温度(T_g),且与纯丙烯酸酯体系相比,乙烯基硅树脂改性后的体系呈现均匀的相分离结构,粒子粒径0.6μm左右;硅树脂与丙烯酸酯的反应程度与反应时间成正比;硅树脂改性丙烯酸酯压敏胶的室温持黏力大于24 h,150℃下持黏力可达到27 min,100℃下的180°剥离强度为6.13 N/25 mm。

Silicone resin modified acrylate pressure-sensitive adhesive was prepared by copolymerization ofvinyl-containing silicone resin into acrylate chain via solution polymerization.The optimal amount and addingmoment of silicone resin were also studied.The research results showed that a new glass transition temperatureappeared in high temperature zone of silicone resin system with vinyl group.A uniform phase separation structurewas presented in the vinyl-containing silicone resin modified system compared with pure acrylate system,andparticle diameter was about 0.6 μm.The degree of the reaction between silicone resin and acrylate was proportionalto the time of their polymerization.The holding power was exceeding 24 h at room temperature and 27 min at150℃,respectively.The 180°peeling strength was 6.13 N/25 mm at 100℃.