摘要
设计了3个外形一致的模块,其中两个在铍铜界面处预制有不同尺寸、形状和位置的缺陷,另一个是无缺陷的完整模块。通过有限元计算方法,分析了预制缺陷对温度分布的影响。通过无缺陷的完整模块的传热分析,评估有效的缺陷位置区域,计算了不同尺寸、形状、位置的缺陷的温度分布;根据对热传导基本公式中的各个量分别进行研究,并通过比较各种因素,得到了缺陷影响铍和铜合金界面温度的主要因素。
Three mock-ups were designed to study the impacts of defects on the temperature distribution of the mock-ups by finite element method, two of them with different dimension, shape and location artificial defects at the interface of beryllium titles and copper alloy, and the other without defect. Firstly the thermal analysis of mock-up without defect was performed, and the valid locations of defects were identified, then, the temperature distribution of mock-ups with different dimension, shape and location of artificial defects was calculated. The parameters from the heat conduction equation were studied individually, and main factors of defects impacting on the temperature of beryllium title and interface of beryllium/copper alloy were concluded by comparison.
作者
康伟山
谌继明
吴继红
袁涛
王平怀
KANG Wei-shan;CHEN Ji-ming;WU Ji-hong;YUAN Tao;WANG Ping-huai(Southwestern Institute of Physics,Chengdu 610041)
出处
《核聚变与等离子体物理》
CAS
CSCD
北大核心
2018年第3期299-304,共6页
Nuclear Fusion and Plasma Physics
关键词
ITER
屏蔽包层
第一壁
热传导
ITER
Shield blanket
First wall
Thermal conduction