挠性板的低损耗纯胶与高频基材匹配研究

The study of low-loss BS and high-frequency substrate for FPCB

高频传输下,材料对讯号完整性影响越显重要。本文介绍目前主流的低损耗挠性板叠构,并探讨低损耗纯胶与高频基材叠构方案,从五种市售低损耗纯胶选材,到产品制作设计的重点测试项目。文章选出一款可兼具贴合主流LCP及PI基板并且符合挠性板信赖性需求之低损耗纯胶,从产品实测插入损耗数据显示,亦具有良好电性。

The influence of materials on signal integrity is getting more and more important under high frequency transmission. This article introduces the current mainstream low-loss FPC stack up, and discusses from seven commercially available low-loss BS materials selection, to the key test items of product design in the low loss BS stack up solution. Here, one low-loss BS that can combine both LCP and MPI substrates and meet the reliability requirements of FPC. It also shows good electrical properties from the measured insertion loss data.