高导热氮化铝陶瓷制备技术的研究现状及发展趋势

Research Status and Development Trend of Preparation Technologies for High Thermal Conductivity Aluminum Nitride Ceramics

氮化铝陶瓷具有高导热率、高温绝缘性和优良介电性能、良好耐腐蚀性、与半导体Si相匹配的膨胀性能等优点,是理想的电子封装散热材料。本文对氮化铝陶瓷粉体制备、成型工艺、烧结等方面的关键技术做出了总结,其中着重总结了氮化铝陶瓷烧结方面的技术发展现状。最后对高导热氮化铝陶瓷制备技术进行了展望。

Aluminum nitride ceramics has the advantage of high thermal conductivity, high temperature insulation, excellent dielectric properties, good corrosion resistance and matching expansion properties with semiconductor Si, which is an ideal material for electronic packaging. The key technologies of aluminum nitride ceramic powder preparation, molding process and sintering are summarized. This paper focuses on the status of the technological development in the sintering of aluminum nitride ceramics. The key technologies of high thermal conductivity aluminum nitride ceramics are forecasted at the end.