某电子芯片厂高平整度一体成型华夫板施工技术

Construction Technology of High Flatness Integrated Forming Waffle Plate in An Electronic Chip Factory

某高端电子芯片厂项目采用的一体成型华夫模板施工,该类型华夫模板的梯形体空腔大,在浇筑混凝土的过程中,混凝土的侧身压力及施工荷载容易将华夫模板压破,导致严重的质量问题。项目部通过在华夫板内部增加木质内支撑加固,增强了华夫板抵抗侧边混凝土及顶部钢筋混凝土的压力,保证了华夫板的施工质量。此外,该电子芯片洁净厂房地面平整度要求非常高,3 m靠尺检查允许平整度偏差2 mm,全区平整度1 m基准线上下15 mm。项目部在先浇筑完成的柱子上,安放调平激光水平仪形成光线平面,以此为基准控制支撑架顶部标高,进而控制平台板平整度的一次调平。该施工技术可随时随地全方位无死角,边搭设支撑架边检测控制,有效的达到一次调平合格的效果。

A high-end electronic chip plant project adopts the construction of integral shaped waffie formwork.The trapezoidal cavity of this type of waffie formwork is large.In the process of pouring concrete,lateral pressure of concrete and construction load are easy to break the waffie formwork,resulting in serious quality problems.The project department increases the pressure of the waffie plate against the side concrete and the top reinforced concrete by adding the wooden internal support to reinforce the waffie plate,which ensures the construction quality of waffie plate.In addition,the flatness of the floor of the electronic chip clean plant is very high.The flatness deviation of 2mm is allowed by 3m ruler inspection,and the flatness of the entire area is up and down by 15mm.The project department will put the leveling laser level gauge on the column after the first casting to form a light plane,which will be used as the benchmark to control the elevation on the top of the support frame,so as to control the levelling of the flat plate.This construction technology can be omnidirectional at any time and place without deadAngle,side set up support frame edge detection control,effective to achieve a leveling qualified effect.