摘要
Graphene possess extremely high thermal conductivity, and they have been regarded as prominent candidates to be used in thermal management of electronic devices. However, addition of graphene inevitably causes dramatic decrease in electrical insulation, which is generally unacceptable for thermal interface materials(TIMs) in real electronic industry. Developing graphene-based nanocomposites with high thermal conductivity and satisfactory electrical insulation is still a challenging issue. In this study,we developed a novel hybrid nanocomposite by incorporating silica-coated graphene nanoplatelets(Silica@GNPs) with polydimethylsiloxane(PDMS) matrix. The obtained Silica@GNP/PDMS composites showed satisfactory electrical insulation(electrical resistivity of over 10^(13)Ωcm) and high thermal conductivity of 0.497 W m-1K-1, increasing by 155% compared with that of neat PDMS, even higher than that of GNP/PDMS composites. Such high thermal conductivity and satisfactory electrical insulation is mainly attributed to the insulating silica-coating, good compatibility between components, strong interfacial bonding, uniform dispersion, and high-efficiency heat transport pathways. There is great potential for the Silica@GNP/PDMS composites to be used as high-performance TIMs in electronic industry.
Graphene possess extremely high thermal conductivity, and they have been regarded as prominent candidates to be used in thermal management of electronic devices. However, addition of graphene inevitably causes dramatic decrease in electrical insulation, which is generally unacceptable for thermal interface materials(TIMs) in real electronic industry. Developing graphene-based nanocomposites with high thermal conductivity and satisfactory electrical insulation is still a challenging issue. In this study,we developed a novel hybrid nanocomposite by incorporating silica-coated graphene nanoplatelets(Silica@GNPs) with polydimethylsiloxane(PDMS) matrix. The obtained Silica@GNP/PDMS composites showed satisfactory electrical insulation(electrical resistivity of over 10^(13)Ωcm) and high thermal conductivity of 0.497 W m-1K-1, increasing by 155% compared with that of neat PDMS, even higher than that of GNP/PDMS composites. Such high thermal conductivity and satisfactory electrical insulation is mainly attributed to the insulating silica-coating, good compatibility between components, strong interfacial bonding, uniform dispersion, and high-efficiency heat transport pathways. There is great potential for the Silica@GNP/PDMS composites to be used as high-performance TIMs in electronic industry.
基金
the financial support from the Ministry of Science and Technology of China(No.2012AA030303)
the Department of Science and Technology of Shenyang City(No.17-231-1-66)
the Hundred Talents Program of Chinese Academy of Sciences(No.CAS2012)
the Fund for Creative Research Groups(No.51221264)
the Fund of Shenyang National Laboratory for Materials Science(Nos.2015RP13 and2017RP11)
