聚酰亚胺纤维增强树脂基复合材料的研究

Study on polyimide fiber reinforced resin matrix composites

以聚酰亚胺纤维为增强体,环氧树脂、双马来酰亚胺树脂、氰酸酯和聚酰亚胺树脂为基体,通过模压成型法制备了4种聚酰亚胺纤维增强的树脂基复合材料。研究了4种基体树脂低聚物的固化行为和流变性能,并表征了4种相应树脂基复合材料的热学、力学、介电性能以及纤维与树脂之间的界面性能。结果表明:4种基体树脂低聚物最低黏度都低于15Pa·s,显示了良好的成型工艺性,环氧树脂基复合材料的力学性能最好,弯曲强度、弯曲模量和层间剪切强度分别达到716MPa、54.9GPa和56.5MPa;聚酰亚胺树脂基复合材料的耐热等级最高,玻璃化转变温度大于300℃;氰酸酯树脂基复合材料的介电性能最优,介电常数在低频段低于3.3。

The polyimide fiber reinforced epoxy resin,bismaleimide resin,cyanate ester and polyimide resin matrix composites were prepared by compression molding.The curing behavior and heological properties of four types of oligomers were researched,and the thermal,mechanical,dielectric properties and the interface morphology between resins and fibers of their corresponding composites were fully characterized.The results showed that the minimum melt viscosities for these oligomers were lower than 15 Pa·s,which was demonstration of their excellent processability.The mechanical properties of epoxy matrix composites were the best,the bending strength,modulus and interlaminar shear strength can reach 716 MPa,54.9 GPa and 56.5 MPa,respectively;the heat-resistance of polyimide matrix composites was the highest,the glass transition temperature can exceed 300℃.The dielectric properties of cyanate ester matrix composites was the most excellent,the dielectric constant was less than 3.3.