废印刷电路板粉填充改性丁苯橡胶复合材料的性能研究

Study on property of SBR filled with nonmetallic powder of waste PCB

以废印刷电路板(PCB)非金属粉对丁苯橡胶(SBR)进行填充改性,采用机械共混法制备了SBR/废PCB粉复合材料,考察了SBR接枝马来酸酐(SBR-g-MAH)、硅烷偶联剂KH-792的引入对SBR/废PCB粉复合材料力学性能及硫化特性的影响。结果表明:SBR-g-MAH和KH-792均能有效提升SBR/废PCB粉复合体系的界面强度,SBR/SBR-g-MAH最佳配比为60/40(质量比,下同),硅烷偶联剂KH-792的最佳用量为3%(质量分数),SBR-gMAH对复合材料的改性效果优于KH-792。当SBR/SBR-g-MAH并用比为60/40,废PCB粉填充量为20份时,复合材料的综合力学性能最佳。改性后的SBR/废PCB粉复合材料的最小扭矩(F_(min))、最大扭矩(F_(max))和正硫化时间(t_(90))均高于纯SBR,而焦烧时间(t_(10))低于纯SBR。

Styrene butadiene rubber(SBR)composites were prepared by mechanical blending method filled with nonmetallic powder from waste printed circuit boards.The effects of maleic anhydride grafted styrene butadiene rubber(SBR-g-MAH),silane coupling agent KH-792 on mechanical and vulcanizing properties of composites were investigated.The results showed that both SBR-g-MAH and KH-792 could improved the interfacial bonding strength of SBR/waste PCB effectively,the optimal ratio of SBR/SBR-g-MAH was 60/40,the optimal dosage of KH-792 was 3%,the modified effect of SBR-g-MAH on the composites was better than that of KH-792.When the ratio of SBR/SBR-gMAH was 60/40 and the content of waste PCB was 20 phr,the composites had the best mechanical properties.The minimum torque(Fmin),maximum torque(Fmax)and positive sulfuration time(t90)of SBR/waste PCB were higher than that of vulcanized SBR after modification,but burning time(t10)decreased.