摘要
对两种不同改性氰酸酯树脂的介电性能、玻璃化转变温度、流变性及力学性能进行了研究。结果表明:70℃下树脂体系黏度为20Pa·s,具有良好的工艺性,适用于热熔法生产预浸料;树脂具有优异的介电性能,介电常数为3.1~3.6,介电损耗角正切值为0.005~0.009;耐温性优异,B类树脂玻璃化转变温度达到240℃。该树脂体系是适合耐高温高性能透波材料应用的树脂基体。
The dielectric performance,glass transition temperature,rheological and mechanical properties of two kinds of modified cyanate ester resin were studied.The results indicated that the resin viscosity under 70℃for 20 Pa·s had good manufacturability to suit for melting prepared prepreg.The resin had excellent dielectric properties,that the dielectric constant reached 3.1~3.6,and the dielectric loss of 0.005~0.009 was shown.The glass transition temperature of B resin reached 240℃.The resin could be used for the resin matrix of high temperature resistance and high performance microwave-transparence materials.
作者
王大伟
林凤森
黄海超
Wang Dawei;Lin Fengsen;Huang Haichao(Weihai Guangwei Composities Co.,Ltd.,Weihai 264200)
出处
《化工新型材料》
CAS
CSCD
北大核心
2019年第1期233-234,242,共3页
New Chemical Materials
关键词
氰酸脂
热熔法预浸料
介电性能
耐温性
cyanate ester
melting prepared prepreg
dielectric performance
heat resistance