加工率对压延铜箔再结晶行为的影响

Influence of Processing Rate on Recrystallization Behavior of Rolled Copper Foil

压延铜箔的再结晶行为受冷变形加工率的影响。对4种不同加工率的压延铜箔进行了不同温度的退火处理,研究了冷变形加工率对铜箔显微组织和性能以及再结晶温度的影响。结果表明:加工率在53%～94%范围内增加时,铜箔位错密度的增加提高了再结晶驱动力,促进再结晶形核和长大,压延铜箔再结晶晶粒尺寸由17.67μm下降到10.44μm,晶粒分布更均匀。

The recrystallization behavior of rolled copper foil is affected by the processing rate of cold deformation. Rolled copper foils with four different processing rates were annealed at different temperatures. The effects of cold deformation processing rates on the microstructure, properties and recrystallization temperature of the copper foil were studied. The results show that when the processing rate increases in the range of 53%-94%, the increase of dislocation density of the copper foil increases the driving force of recrystallization and promotes the nucleation and growth of recrystallization. and the recrystallized grain size of the rolled copper foil decreases from 17.67 μm to 10.44 μm, The grain distribution is more uniform.