摘要
本文论述了集成电路现状及发展,介绍了世界和我国框架用铜合金材料研究和生产情况,包括 IC 框架对材料的要求,铜合金框架材料,框架铜带现代生产方法。在此基础上,提出我国 IC 铜合金带材产业化的必要性和可行性,指出产业化已刻不容缓和迫在眉睫。
This paper introduces IC development and current situation and expounds the researches and production situations of the cop- per alloy materials for leading frames at home and abroad,including the alloy systems,performance requirements and modernized pro- duction technologies of the copper strip of IC leading frames.Furthermore,the paper proposes the necessity and feasibility of large- scale production of the IC copper alloy strip in our country,which brooks no delay and extremely urgent.
出处
《有色金属加工》
CAS
2002年第2期9-16,23,共9页
Nonferrous Metals Processing
