摘要
微结构气敏传感器由于其微型化、低功耗、易阵列化和易批量生产等优点而受到国内外研究者的广泛关注。利用微机电系统 (MEMS)加工技术 ,制备Si基膜片型微结构单元 ,并分析其热学性能。这种单元工作区温度为～ 30 0℃时 ,加热功率约75mW ;并且膜片工作区的热质量很小 ,温度可以于毫秒量级的时间内 ,在室温和4 50℃之间调制。利用这种微结构单元 ,可以在温度调制方式下 。
Much attention has been paid to micro gas sensors (MGS) because of their advantages, e.g., miniaturization, low power consumption, ease of integration (into arrays or with circuit) and batch production, etc.The thermal properties of Si based module of membrane type MGS manufactured by MEMS technology are reported. The heating power of the module is about 75mW when the temperature of working area is ～300℃. The temperature of working area can be modulated between room temperature and 450℃ in a few milliseconds because the membrane has a small thermal mass. Using this module, the electrical properties and the sensitive mechanism of gas sensing film can be studied in the temperature modulated mode.
出处
《微细加工技术》
2002年第1期50-53,55,共5页
Microfabrication Technology
