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微硅高g加速度传感器工艺研究 被引量:1

Research of Technology for a Micro Piezoresistive High-g Acceleration Sensor
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摘要 主要介绍在制作一种压阻式微硅高 g(g =9 8m/s2 ,微重力加速度值 )加速度传感器的过程中 ,所遇到的工艺问题及其解决方法。并较详细地叙述了涉及到的键合 (SDB)、双面光刻及传感器几何图形的精确控制等关键技术。 Technology problems and their solutions during making a kind of micro piezoresistive high-g acceleration sensor are presented. The key techniques including SDB, double-side lithography and the control of the geometric patterns of the sensor are also introduced in detail.
作者 张中平
出处 《仪表技术与传感器》 CSCD 北大核心 2002年第4期1-3,共3页 Instrument Technique and Sensor
关键词 高g加速度计 光刻 腐蚀 键合 微硅高g加速度传感器 High-g Accelerometer Lithography Etching Silicon Direct Bonding
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  • 1Navid Yazdi ,farrokh Ayazi, Khalil Najafi. Micromachined Inertial Sensors[ J ]. Proceedings of the IEEE. 1998,86 ( 8 ) : 1640 -1659.
  • 2WANG Li-peng, Richard A, Wolf J, et al. Design, Fabrication and Measurement of High-sensitivity Piezoelectric Microelectromechanical Systems Accelerometers [ J ]. Journal of Microelectromechanical Systems,2003,12 (4) :433 - 439.
  • 3Kei Ishihara, YUNG Chi-fan, Arturo A, et al. An Inertial Sensor Technology Using DRIE and Wafer Bonding with Interconnecting Capability [ J ]. Journal of Microelectromechanical Systems, 1999,8(4) :403 -408.

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