摘要
对多层印制板生产中的阻焊膜保护技术进行了详细阐述。对阻焊膜制作的工艺过程、工序过程质量控制。
The protective technology of solder mask was described for production of multiplayer printed circuit boards, and also the preparing process of solder mask, process quality controlling,reasons of quality problem and relevant countermeasures were introduced.
出处
《材料保护》
CAS
CSCD
北大核心
2002年第3期49-50,53,共3页
Materials Protection
关键词
多层印制板
非金属材料
阻焊膜
过程质量控制
multiplayer printed circuit board
protective technology
solder mask
process quality control
