摘要
塑封器件的后固化 ,早已被确认为固定工艺。通常是侧重于解决器件环境试验中存在的问题。
It has been well known that the post solidification of devices with plastic package is a fixed step during processing.Usually,our purpose is to get the solution to the problems occurred during environment test;unexpectedly,it is discoveded that the post solidification of edvices has magic remedy effect to some special devices.
出处
《微电子技术》
2002年第1期39-42,共4页
Microelectronic Technology
关键词
塑封管
固化效果
半导体器件
Microphone device
Small signal
Leakage current
Post solidification
Temperature of vitrification
Drop at low frequency
Forward clamping