期刊文献+

研讨特种塑封管的再后固化效果

On the Post-solidification Effect of Special Devices with Plastic Package
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摘要 塑封器件的后固化 ,早已被确认为固定工艺。通常是侧重于解决器件环境试验中存在的问题。 It has been well known that the post solidification of devices with plastic package is a fixed step during processing.Usually,our purpose is to get the solution to the problems occurred during environment test;unexpectedly,it is discoveded that the post solidification of edvices has magic remedy effect to some special devices.
作者 张鸿升
出处 《微电子技术》 2002年第1期39-42,共4页 Microelectronic Technology
关键词 塑封管 固化效果 半导体器件 Microphone device Small signal Leakage current Post solidification Temperature of vitrification Drop at low frequency Forward clamping
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