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随机载荷下疲劳寿命预估计算方法研究 被引量:4

Research on an efficient calculating method for fatigue life predicting under random loading
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摘要 分析了一种用于随机载荷下零构件疲劳寿命预估的有效计算方法 .引入材料所吸收的弹性应变能和塑性应变能等参量 ,在等能量损伤法则下推算出稳态条件下随机载荷的等价常幅应力 ,适用于结构设计阶段和改进阶段或应力响应时间历程无法实测的情况 . In this paper, an efficient calculating method for fatigue life prediciting under random loading is analyzed. According to the damage principle of equivalent energy, the equivalent constant stress of the random loading in the steady state is deduced by introducing some parameters such as the elastic strain energy and plastic strain energy absorbed by material. The method is particularly useful for predicting the service life when structures and components are designed or improved.
出处 《海军工程大学学报》 CAS 2002年第2期31-33,50,共4页 Journal of Naval University of Engineering
关键词 功率谱密度 弹塑性应变能 随机载荷 疲劳寿命预估 计算方法 fatigue life random loading power spectral density elastic strain energy and plastic strain energy
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  • 1王通北,陈美英.发动机零件的低循环疲劳寿命消耗和循环换算率[J].航空发动机,1995,16(1):10-18. 被引量:10
  • 2冯振宇,诸德培,林富甲.随机载荷下疲劳寿命的估算[J].机械科学与技术,1996,15(6):879-882. 被引量:13
  • 3陆山,吕文林.轮盘低周疲劳寿命可靠性分析新方法[J].航空学报,1997,18(2):135-138. 被引量:11
  • 4Dave S. Steinberg, Vibration vnalysis for electronic equipment[D ]. Second edition, A Wiley- interscience publication,JOHN WILEY & SONS, 1989.
  • 5Wu J D, Ho S H, etc. Board level reliability of a stacked CSP subjected to cyclic bending [J],Microelectronic Reliability, 42 (2002),407-416
  • 6Tong Yan Tee, Hun Shen Ng, etc. Board level solder joint reliability modeling and testing of TFBGA packages for telecommunication application [J], Microelectronics Reliability, (43)2003,1117-1123
  • 7Amagai M. Chip Scale Package(CSP)solder joint reliability and modeling [J], Microelectronics Reliability,(39) 1999,463-477
  • 8Tong Yan Tee, Hun Shen Ng, etc. Comprehensive board-level solder joint reliability modeling and testing of QFN and Power QFN Packages [J], Microelectronics Reliability,(43) 2003, 1329-1338
  • 9Dave S .Steinberg, Vibration Analysis for Electronic Equipment [M],Second Edition ,A Wiley-Interscience Publication,JOHN WILEY & SONS, 1989
  • 10周敏亮,陈忠明.飞机结构的随机振动疲劳分析方法[J].飞机设计,2008,28(2):46-49. 被引量:29

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