摘要
本文简要介绍了BGA与CSP的概念、发展现状、应用情况及发展趋势等。BGA/CSP是是现代组装技术的两个新概念,它们的出现促进SMT(表面贴装技术)与SMD(表面贴装元器件)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。
The things of the BGA/CSP’s concept, development and application are simplyintroduced. BGA and CSP are new concepts of contemporary assembly technology. BGA/CSP hasdeveloped and innovated the SMT/SMD since they were appeared. It is believed that BGA/CSP willbe the best choice of the IC with density, high performance, multiple function and high I/Os.
出处
《半导体技术》
CAS
CSCD
北大核心
2002年第5期9-11,共3页
Semiconductor Technology
