摘要
通过对一批七专电路键合点严重腐蚀的失效分析,提出了相应的改进措施,使产品的可靠性得到了保障。
By analyzing the failure of a batch of special circuit bonding point that has beenseriously corroded, the improvement methods to ensure device reliability are put forward.
出处
《半导体技术》
CAS
CSCD
北大核心
2002年第5期67-68,共2页
Semiconductor Technology
