摘要
激光化学半导体技术及其在半导体器件和集成电路制备中的应用是过去10年半导体微细加工领域中最引人注目的研究课题之一。本文综述了这种技术的基本原理、特点和加工方法,重点介绍了它在半导体器件和集成电路制备中的应用,最后展望了它的今后发展方向。
Applications of laser chemical semiconductor technologies to semiconductor device and IC fabrication have been one of the most attractive fields for micro-fabrication in the last decade. In this paper, the basic principles, important features and processing methods for these technologies are reviewed, with emphasis on their applications to semiconductor device and IC fabrication. Finally, the trend of development for the technology is predicted.
出处
《微电子学》
CAS
CSCD
1991年第1期20-25,共6页
Microelectronics