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光电子集成电路材料制作工艺的进展 被引量:1

Recent Advances in Material Technology for Optoelectronic Integrated Circuits
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摘要 光电子集成电路的未来进步主要取决于Ⅲ-Ⅴ族材料的合成技术,特别是汽相外延和分子束外延技术的持续进展,以及各种材料加工技术的发展。本文将对此作比较详尽的叙述。 The future advancement of optoelectronic integrated circuits lies in the continua-tive development of synthesizing technology,especially the vapour phase epitaxy(VPE) and the molecular beam epitaxy(MBE), for Ⅲ-Ⅴ family materials and of the processing technology for various materials. A detailed description is given for the above.
作者 杨清宗
机构地区 机电部
出处 《微电子学》 CAS CSCD 1991年第2期31-35,共5页 Microelectronics
关键词 集成电路 半导体材料 工艺 光电子 Optoelectronic Integrated Circuit, Semiconductor Material, Ⅲ-Ⅴ family Semiconductor,Vapour Phase Epitaxy, Molecular Beam Epitaxy, Metal-Organic Chemical Vapour Deposition
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  • 1王琦,黄辉,王兴妍,黄永清,任晓敏.新型长波长InP基谐振腔增强型光探测器[J].中国激光,2004,31(12):1487-1490. 被引量:4
  • 2杨卫东,张正璠,李开成,欧红旗,黄文刚.一种硅光电接收处理集成电路的技术研究[J].微电子学,2006,36(6):767-769. 被引量:2
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