摘要
微电子技术的发展对材料提出了更高的要求。本文评述了硅材料与其它半导体、绝缘物和导体的单片兼容技术及应用。
The development of microelectronic technology has imposed more and more requirements on materials.In this paper,a review is made on monolithic compatibility of silicon with other semiconductors,insulators and conductors,and on its applications.
出处
《微电子学》
CAS
CSCD
1991年第4期1-12,共12页
Microelectronics
关键词
微电子技术
微细加工
材料兼容
Silicon,GaAs, Material compatibility technology,SOI technology, Silicon bonding technology
