摘要
本文研究了如何运用CO_2激光清洗控制电缆多芯插头霉菌,分析了清洗机理,设计了实验装置,对影响激光清洗效果和实际应用的关键因素进行了重点讨论。分析和实验结果表明,在激光参数选择合适的情况下可实现对霉菌的完全清洗而不会对插头基体造成损伤,激光清洗技术能够安全有效地清除控制电缆多芯插头上生长的霉菌。激光清洗霉菌的机理有:一、激光产生的高温导致霉菌的瞬间汽化和燃烧;二、基体表面在激光辐照射下温度发生急剧变化而产生热膨胀变形导致的加速度及插头座芯孔狭小空间内空气急剧膨胀导致的内外气体之间的巨大压差,将霉菌从插头上除去。
Laser- induced removal of mildew from the multiple - pin plug of the control cable was investigated. The major mechanism of laser cleaning was analyzed. The device of removal mildew from the multiple- pin plug was designed. The key factors that affect the cleaning effect and practical application were discussed in detailed in this paper. The experimental results showed that if the laser parameters are chosen properly, the mildew can be full removed without any damage on the multiple- pin plug. The analyses demonstrated that laser cleaning method can be used to complete the special cleaning task.
出处
《应用激光》
CSCD
北大核心
2002年第2期233-235,共3页
Applied Laser
关键词
激光清洗
霉菌
多芯插头
清洗机理
mildew, laser cleaning, multiple - pin plug, mechanism