摘要
论述了多晶硅高温压力传感器小型化固态隔离封装技术、静电键合技术、不锈钢膜片的选择及波纹设计技术、激光焊接技术、硅油充灌和硅油隔离技术等。以不锈钢膜片和高温硅油为隔离材料,使传感器的封装直径缩小到15 mm,在1 mA电流激励下传感器满量程输出为72 mV,零点稳定性为0.48%F.S/mon,提高了传感器的可靠性,拓宽了传感器的应用领域。
This paper mainly discusses miniature isolated solid-state encapsulation technology of high-temperature polysilicon pressure sensor, including static electricity bonding ,stainless steel diaphragm selection and rippled design,laser welding,silicon oil infilling, isolation and other technologies used in sensor packaging. By adopting stainless steel diaphragm and high-temperature silicon oil as isolation materials, not only the encapsulation diameter of sensor is as small as 15 mm and under 1 mA drive,its full range output is 72 mV and zero stability is 0.48%F.S/mon ,but also the reliability of the sensor is improved and its application is widely broadened.
出处
《电子科技大学学报》
EI
CAS
CSCD
北大核心
2002年第2期196-199,共4页
Journal of University of Electronic Science and Technology of China
基金
国家自然科学基金资助项目编号:69876207
关键词
封装技术
高温
压力传感器
固态隔离
high-temperature
pressure sensor
static electricity bonding
isolated solid-state
encapsulation
silicon oil infilling
