不同状态的SiAl丝对混合集成电路键合点根部损伤的影响

Effect of SiAl Wires on Root Damage of HIC Bonding Pads

键合点根部损伤是Al丝超声键合工艺中最常见的问题之一,严重的根部损伤不仅使焊点的键合强度降低,甚至会使键合点失效。本文通过优化键合机器的工艺参数,分析键合丝的组成成份和采取不同的退火条件,研究Al丝超声键合中键合点根部损伤的程度,为键合丝的选用提供依据,也为进一步提高Al丝超声键合强度做一些基础工作。

The paper analyzes the contents and differential annealing conditions of bonding wires through optimization of processing parameters of bonding machine, and researches on root damages of bonded pads, in ultrasonic soldering of aluminium wires, giving the bases of wire selection.