超级CSP——一种晶圆片级封装

Super CSP——a Wafer-Level Package

研究了圆片级芯片尺寸封装。使用再分布技术的圆片级封装制作了倒装芯片面阵列。如果用下填充技术,在再分布层里和焊结处的热疲劳应力可以减小,使倒装芯片组装获得大的可靠性。

In this paper, wafer level chip scale packaging (WLCSP - WLP) will be investigated. WLP using redistribution technology is to make area array flip chip. Thermal Fatigue stresses in redistribution layer and at solder joint may decrease, if use underfill technology. High reliability of flip chip assemblies is achieved.