电子封装材料用环氧树脂增韧研究进展

Toughening methods of epoxy resins for electric encapsulation materials

未改性环氧树脂固化物存在质脆、冲击性能差等缺点 ,限制了它在复杂环境下的应用。针对这些不足 ,国内外科研工作者对其进行了大量改性研究。

The impact toughness of unmodified cured epoxy resins is poor,which restricts its applications under complicated encapsulation environment.The toughening modification methods for epoxy resins were summarized in this paper.Toughening materials of epoxy resins include rubbers,core-shell polymer,thermal-plastic resins,liquid crystalline polymer,rigid inorganic particles and so on.