摘要
介绍了在反射式SAM技术基础上开发的一种失效分析新技术——双波透射SAM技术的原理和应用特点。该技术依据声波在界面的反射系数R与材料声阴Z的关系，采用双程透射方法，通过入射和反射声波强度的地比分析，对界面缺陷进行定位，它是解决传统反射式SAM技术不能准确探测复杂结 构界面缺陷，替代（单波）透射技术的又一新方法。
The basic principle and the applications of a double through transmission ultrasonic technique used for IC packaging inspection is presented. The technique is applied to identify the internal defects in the thin packages, by analysing the ultrasound energy which goes through and back through the IC package. It overcomes the difficulties of the traditional pulse - echo SAM methods and is the new method instead of the (single) transimission SAM.
出处
《电子产品可靠性与环境试验》
2002年第1期5-8,共4页
Electronic Product Reliability and Environmental Testing
