摘要
可靠的热分析、热设计是提高印制电路板热可靠性的重要措施。在分析热设计基本知识的基础上，讨论了散热方式的选择问题和具体的热设计、热分析技术措施。
The reliable thermal analysis & design is an important measure to improving the PCB' s reliability. Based on the basic knowledge of thermal design, the question of selecting the cooling plan and the specific technical measure of thermal analysis & design are discussed in this article.
出处
《电子产品可靠性与环境试验》
2002年第1期34-38,共5页
Electronic Product Reliability and Environmental Testing
