摘要
研究了电镀金刚石的工艺条件 .实验表明 :采用所给定的电镀工艺条件 ,可获得金刚石含量为 9%～ 1 1 %的优质复合电镀层 .其层内金刚石微粒分布均匀 ,镀层沉积速度为 2 0μm/h,结合力好 ,经 40 0℃保温 1 h后 ,水冷镀层不掉皮 ,锤击金刚石微粒不脱落 ,完全适合于超声波条件下的加工 .
The electroplating diamond technology has been researched in this paper. The experiment has shown that the 9%～12% diamond compound plating layer is attained. The deposits speed is 10～15 μm/h. When heating it to 400℃ and keeping it for 1 hour after that and putting it into cold water, the plating layer is not apart. It could be used in ultrasonic machining.
出处
《沈阳工业学院学报》
2002年第2期43-46,共4页
Journal of Shenyang Institute of Technology
