摘要
考察了金属封装外壳制造工艺对外引线弯曲疲劳的影响,发现电镀镍是导致外引线弯曲次数明显减少的最主要工艺步骤,且随镀镍层厚度的增加,弯曲次数减少。此外还讨论了外引线的氢含量和晶粒度对引线抗疲劳能力的影响。
Effect of process conditions on fatigue strength of leads for metallic package was investigated. Electroplating is one of the major factors that affect the fatigue strength of the leads. As the thickness of nickel electroplating increases, lead bending strength decreases. The effect of hydrogen content and grain size of leads on the fatigue strength is also discussed.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2002年第6期8-10,共3页
Electronic Components And Materials
关键词
金属封装
外引线
弯曲疲劳
氢
晶粒度
电镀镍
metallic package
leads
bend fatigue
hydrogen
grain size
nickel electroplating