摘要
摘要:重点介绍了BGA与CSP高密度封装技术的发展现状及趋势。BGA与CSP是现代组装技术的两个新概念,它们的出现促进了表面贴装技术(SMT)与表面贴装元器件(SMD)的发展和革新,并将成为高密度、高性能、多功能及高I/O数封装的最佳选择。
The present status and tendency of BGA and CSP high density technologies are presented. BGA and CSP are new concepts of update package technology, which has promoted the innovation and development of SMT and SMD. It is believed that BGA/CSP will be the best technologies for high density ICs with high performances, multiple functions and high I/Os.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2001年第6期20-21,共2页
Electronic Components And Materials
