摘要
采用差示扫描量热 (DSC)技术测定了在芳胺类为固化剂的条件下 ,增韧环氧体系固化反应过程中的热行为。得出固化反应过程的动力学参数 ,实验数据表明 :以芳胺为固化剂的体系中 ,固化反应表观活化能及动力学频率因子 。
The heat effects of curing kinetics of various toughed epoxy resin composites with aromatic amine crosslinking agent were investigated by the DSC technology,and kinetic parameters of curing reaction were derived.The experimental results show the apparent activation energy,kinetic frequency factor and reaction order were obviously decreased,and this experimental method can be used for epoxy curing technology.
出处
《粘接》
CAS
2001年第6期4-6,共3页
Adhesion