摘要
主要叙述表面安装工艺(SMT)中元器件偏移等质量缺陷,分析研究了各种缺陷出现的原因和现象,在工艺上采取各种措施,解决SMT工艺中出现的各种元器件的偏移。
The shift of components and devices in surface mount technology(SMT) is mainly described, the causes and phenomena about various defects are analyzed, the several technical countermeasures are provided to prevent the shifts of components and devices.
出处
《电子元器件应用》
2001年第12期45-46,48,共3页
Electronic Component & Device Applications
