金刚石框架锯锯切研究(2)──锯切破碎机理

Study on the Frame Sawing with Diamond Blades(Ⅱ)──Cutting Mechanism

在对金刚石框架锯锯切加工动力学研究的基础上 ,通过单颗粒划痕和单个金刚石结块切削大理石试验 ,模拟金刚石框架锯锯切过程中 ,金刚石颗粒和结块在不同加工条件下的切削过程 ;测量分析了切削力、表面沟槽轮廓和有效切削磨粒数 ;观察并分析了加工表面形貌 ;运用岩石脆性断裂力学理论 ,分析了单颗粒金刚石切削机理。通过金刚石框架锯锯切加工大理石的切屑粒度分布分析 ,指出了实际加工切削条件对锯切破碎机理的影响。研究结果证实了金刚石框架锯锯切加工动力学研究的一些基本结论 ,最后提出了金刚石框架锯锯切大理石破碎机理模型。

With different cutting conditions, the frame sawing process is simulated by the cutting experiments with single and single diamond segment on CNC milling and by the sawing experiment on a model machine. The surface topographies of machined surfaces are observed, the surface profiles and the cutting forces as well as the distribution of chip sizes in the frame sawing process are measured. The results showed that the intercross of the cracks generated by different diamonds on various positions will decide the final removal mechanism of stone. Only a few diamonds act as effective cutting edges. In sawing process the depth of cut of diamond or segment, shape and orientation of diamond, coolant, cutting paths and the properties of stone and so on will affect the removal of stone as plastic deformation and fracture, the cutting forces and the chip sizes. Finally a cutting mechanism model for frame sawing is provided.