摘要
简述了××小口径弹及其包装材料 ,在模仿野战环境下贮存 ,进行霉菌试验的概况 ,分析了长霉的条件、霉菌腐蚀机理 ,提出了使用防霉剂和控制包装内相对湿度等防霉措施。
The fungus test of a small cartridge and its packaging materials in simulative combat environment was introduced. The environmental condition of fungus growing and the corrosiveness of fungus was analyzed and the anti-fungus methods such as using fungicide and controlling RH inside of package was suggested.
出处
《包装工程》
CAS
CSCD
北大核心
2002年第3期11-13,共3页
Packaging Engineering