电化学分析法研究化学镀镍的沉积速度

Study on the Deposition Rate of Electroless Nickel Using Electrochemical Analysis

实验采用电化学分析法研究化学镀镍的沉积速度。通过分别测定含有不同添加剂的化学镀镍反应过程的极化曲线 ,确定电化学参数变化对化学镀镍沉积速度的影响。结果表明 :电化学分析法可以直接用来分析化学镀镍的沉积速度。添加剂的加入对化学镀镍反应的主要控制步骤还原剂的阳极氧化过程的影响比较明显 ,阳极氧化电流越大 ,氧化反应速度越大 ,化学镀镍的沉积速度越快。电化学分析法为化学镀镍提供了一种较新的研究方法。

The deposition rate of electroless Ni P was studied by electrochemical analysis. The influence of electrochemical parameters on the deposition rate was examined through the polarization plots of the reactions occurred in the plating baths with different additives. The results show that the deposition rate of electroless Ni P can be measured directly by the method, because the additives influence significantly the anodic oxidation of the reducer , which is the main controlling step of the plating process. The higher the anodic oxidation current, the higher the oxidation speed and hence the higher the deposition rate.