用于ULSI铜布线的化学机械抛光分析

Analysis and Study on CMP of Copper Interconnects for ULSI

对ＵＬＳＩ中多层金属铜布线的ＣＭＰ（化学机械抛光）进行了理论分析，介绍了Ｃｕ－ＣＭＰ模型与机理及其动力学过程，抛光液的种类及其存在的问题，并对Ｃｕ－ＣＭＰ的研究作了进一步探讨．

The CMP of Copper interconnects in ULSI was analysised in thiery, with the detailed introduce of the model and mechamism of Cu-CMP, the processes of Kinetics, the types of slurry for Cu - CMP and the existed questions. At the same time, the investigate of Cu - CMP was discussed further.