摘要
对于Ta/NiFe/Cu/NiFe/FeMn/Ta自旋阀多层膜,Cu原子偏聚到NiFe/FeMn界面将导致自旋阀多层膜中NiFe/FeMn的交换耦合场Hex下降.然而,少量的表面活化原子Bi被沉积到Cu层和被钉扎NiFe层之间,Cu原子在NiFe/FeMn界面的偏聚可以被抑制:而且,更重要的是Ta/NiFe/Cu/NiFe/FeMn/Ta自旋阀多层膜中的交换耦合场Hex可以被有效地提高.
Experimental results show that Cu atoms can float out or segregate to the NiFe/FeMn interface for Ta/NiFe/Cu/NiFe/FeMn/Ta spin-valve multilayers, which results in a fall of the exchange coupling field (Hex) of NiFe/FeMn in the spin-valve multilayers. However, when a small amount of Bi atoms are deposited between Cu and pinned NiFe layer for the spin-valve multilayers, the Cu atoms' segregation to the NiFe/FeMn interface can be suppressed. At the same time, the Hex of NiFe/FeMn in the spin-valve multilayers with a Bi insetting layer can be effectively increased.
出处
《金属学报》
SCIE
EI
CAS
CSCD
北大核心
2002年第6期617-620,共4页
Acta Metallurgica Sinica
基金
国家自然科学基金19890310
北京市自然科学基金2012011资助项目
关键词
层间偏聚
交换耦合场
表面活化原子
BI
XPS
interlayer segregation, exchange coupling field, surface-active atom Bi, X-ray photoelectron spectroscopy