摘要
介绍了当前IC几项新工艺、新技术的发展动向 ,包括设计尺寸微细化工艺、30 0mm圆片工艺、铜互连技术、无铅工艺和嵌入式技术。
This paper introduces the developing trend of the Current several new processes and technology,including the design rule microminaturization,300 mm wafer process,copper interconnection,non-plumbum process and embedded technology.
出处
《电子工业专用设备》
2002年第1期7-10,共4页
Equipment for Electronic Products Manufacturing
