摘要
通过对国内外半导体切割设备行业的发展与现状分析 ,根据国际IC业最先进的工艺要求 ,提出了切割设备的发展趋势 ;并对切割设备的发展提出了参考性意见。
This paper describes home and abroad semiconductor slicing equpments'outlook, according to the world's advanced process requirement on IC industry, states briefly that the whole slicing machines development tendency, advices on slicing machine are given at last .
出处
《电子工业专用设备》
2002年第1期21-23,共3页
Equipment for Electronic Products Manufacturing
关键词
切片机
线锯
立式
卧式
硬脆材料
TTV值
残余应力
slicing machines
jigsaw
vertical
horizontal
crisp and hard material
wafer TTV value
residual stres
