摘要
研究了化学镀锡液中的络合剂、还原剂和催化剂等因素对沉积速度和镀液的稳定性的影响。利用可在金属锡表面吸附的贵金属络合物 K2 [Pd F6]的催化作用 ,大幅度提高了沉积速度 。
Effect of complex agent, reducing agent and catalytic agent, etc. in electroless tin bath is studied on deposition rate and stability of tin bath. The deposition rate is greatly increased with catalysis of noble metal complex K 2 adsorbed on metal tin surface, so the thick electroless tin deposit is obtained.
出处
《南京航空航天大学学报》
EI
CAS
CSCD
北大核心
2002年第3期262-265,共4页
Journal of Nanjing University of Aeronautics & Astronautics
关键词
化学镀
催化
镀锡层
化学工艺
沉积速度
络合剂
electroless plating
tin plating
catalysis
thick tin deposit
new process
