摘要
LTCC基板的失效分析表明,通孔与导带间开路是多层基板布线互连失效的主要模式,原因是基板在共烧工艺过程中,布线金属与陶瓷材料收缩失配产生的界面应力导致布线开路。调整布线金属和陶瓷材料的致密化温度和基板收缩率后,有效控制了两种不同材料的界面收缩失配,消除了开路失效。
The open failure between via holes and traces in LTCC substrate had been studied. This failure mode is the most important one in LTCC. The reason of resulting in this failure is the interfacial tension between traces metal and ceramics at co - fired processing. By means of coher ent shrinkage and soften point, the open failure had been eliminated effectively.
出处
《电子产品可靠性与环境试验》
2002年第3期4-8,共5页
Electronic Product Reliability and Environmental Testing
