摘要
介绍高频印刷电路板基材的介电性能要求和几种典型的覆铜板材的介电性能,以高溴化环氧树脂(EP)、酚醛EP、改性聚苯醚(MPPO)、酸酐固化剂、咪唑促进剂配制胶粘剂体系,经偶联剂处理的E型无碱玻璃布为增强材料,采用通用上胶与压制工艺,研制了一种适用于高频电路条件下的介电性能优异、成本低的高频覆铜板。
Some requirements in dielectric property of the high frequency PCB and several typical copper dads' requirementsin dielectric property are introduced, and one kind of copper clad in circuit of high frequency with excellent dielectric property and low cost is mainly researched, which is with epoxy resin modified with MPPO as adhesive and glass cloth without alkali metal element as a kind of reinforced material.
出处
《工程塑料应用》
CAS
CSCD
北大核心
2002年第4期35-37,共3页
Engineering Plastics Application
